On July 16, 2024, China FAW Group Corporation and ZTE Corporation signed a strategic cooperation agreement on the “Hongqi No.1” multi-domain integrated chip at the New Energy Smart Vehicle Modern Industry Chain Common Chain Action Conference. This agreement aims to promote cooperation in the fields of automotive, chip definition, chip development, and communications. Both parties will work together to drive new developments in the automotive chip industry, realizing better cooperation and development in automotive chip technology.
Source: China FAW (July 17, 2024)
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